XGZP168 is a surface mounting pressure sensor based on CF Sensor silicon based piezoresistive pressure sensor die.
The sensor die is bonded on a substrate with a plastic cap and packaged in a 6-pin SOP or DIP. The small size and high reliability of on-chip integration make this sensor a simple and economical choice for high volume application in a variety of industries. With standard SOP6 or DIP6 package, XGZP168 is easy for users to install by SMT or through hole board assembly.
With good repeatability, linearity, stability and sensibility,
high pressure sensor XGZP168 is very facile for users to calibrate output & thermal drift and make
temperature compensation by using exterior operational amplifier or integrated circuit.
(For calibrated pressure sensor if required, please refer to CF Sensor pressure sensor module series).
The XGZP168 high pressure sensor is intended for using with non-corrosive gas or air.
It is highly prohibited to choke the side of pressure diaphragm during actual application.
Please consult us if a pressure medium other then air is to be used.
Applications:
- For medical and healthy equipment, e.g. Blood pressure test and monitor, Patient Monitoring, Infusionand Syringe Pumps, Anesthesia machines, Respirators and Ventilators, NPWT, DVT, Catheter, COPDTreatment, Kidney dialysis, Cupping & Cosmetology, Hospital beds, Massage device etc.
- For white goods and consumer electronics, e.g. Refrigerator, Printer, Humidifier, Washer/Dryer, Coffee machine, Dust collector or Cleaner, Robotic, Sport equipment etc.
- For more fields, e.g. Air pump, Process control, Pressure switching, HVAC and pneumatic device, Air
flow monitor, Automation, Automotive application etc
Datasheet for XGZP168 701S CF Pressure Sensor
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Packing List:
1 x XGZP168 701S CF Pressure Sensor
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